XMG Unveils NEO 16 Laptop with NVIDIA RTX 5090 GPU and AMD Ryzen AI 300 APUs at CES 2025
Introduction to XMG's Latest Innovations
At the highly anticipated Consumer Electronics Show (CES) 2025 in Las Vegas, XMG has taken center stage with the introduction of their cutting-edge NEO 16 laptop. This high-performance machine is designed for tech enthusiasts and professionals who demand superior processing power and graphics capabilities. The NEO 16 features a powerful Intel Core Ultra 9 275HX processor and an NVIDIA GeForce RTX 5090 graphics card, boasting 24 GB of GDDR6 VRAM. In addition to Intel's offerings, XMG has expanded its lineup to include EVO ultrabooks powered by AMD’s Strix "Ryzen AI 300" APUs, showcasing the latest advancements in mobile computing technology.
Impressive Hardware and Design Features
The 2025 model of the XMG NEO 16 represents a complete redesign, making it not only aesthetically appealing but also functionally superior. The equipment includes cutting-edge hardware, such as the Intel Arrow Lake-derived Core Ultra 9 275HX processor equipped with 24 cores, and NVIDIA's flagship GeForce RTX 5090 GPU. The laptop is notable for supporting up to 96 GB of DDR5 CSO-DIMM RAM with a significant speed of 6400 MT/s, a remarkable feat made possible by integrating the latest CU-DIMM technology.
This high-end creation also offers an optional mini-LED display upgrade that delivers 1000 nits brightness, 100% DCI-P3 color space coverage, and enhanced screen durability through improved hinge technology. Measuring 356.7 x 259.9 x 27.5 mm and weighing approximately 2.4 kg (or 2.6 kg with the mini-LED display), the NEO 16 balances power with portability perfectly.
Advanced Cooling and Modular Mechanisms
One of the standout features of the NEO 16 is its reimagined internal architecture. Key components such as the CPU, RAM, and SSD are assembled on a dedicated motherboard, whereas the GPU is stationed on a separate board that connects to the motherboard using a screw-fastened connector. This modular architecture permits flexibility in component upgrades, ensuring that users can personalize their devices according to evolving technology trends.
Complementing its modular design, the cooling assembly of the NEO 16 has been elevated with the inclusion of three fans and improved airflow passages. This configuration significantly boosts thermal management by maximizing air pressure and circumnavigating the increased heat production associated with high-powered processors and GPUs.
Cutting-Edge EVO Ultrabooks with AMD Ryzen AI 300 APUs
Alongside the NEO 16, XMG is introducing the next generation of EVO ultrabooks, now equipped with AMD's innovative Ryzen AI 300 series processors. These devices extend the remarkable performance and AI processing capabilities that AMD is known for, maintaining upgradeable RAM for enhanced flexibility. The EVO series continues to advance XMG's mission to cater to users requiring excellence in portable computing without compromising on power or customization.
A Leap Forward in Tech Mobility and Performance
The CES 2025 announcement underscores XMG's commitment to leading the industry with devices that offer unparalleled performance and versatility. By announcing products like the NEO 16 and EVO ultrabooks, XMG not only meets but exceeds consumer expectations for high-end gaming laptops and professional computing solutions. The inclusion of both Intel and AMD's latest technologies further demonstrates their strategy to merge the best of both worlds, offering consumers unrivaled choice and quality.
